Hoʻohana i ka laina kelepona hope SMT ma ka ʻoihana uila 3C
ʻO GREEN kahi National High-Tech Enterprise i hoʻolaʻa ʻia no ka R&D a me ka hana ʻana o ka hui uila uila a me nā lako semiconductor packaging & hoʻāʻo.
Ke lawelawe nei i nā alakaʻi ʻoihana e like me BYD, Foxconn, TDK, SMIC, Canadian Solar, Midea, a me 20+ mau ʻoihana Fortune Global 500. ʻO kāu hoa hilinaʻi no nā hāʻina hana kiʻekiʻe.
ʻO Surface Mount Technology (SMT) ke kaʻina hana nui i ka hana ʻenehana uila hou, ʻoi loa no ka ʻoihana 3C (kamepiula, kamaʻilio, nā mea kūʻai uila). Hoʻopili ia i nā mea alakaʻi ʻole / pōkole-lead (SMDs) pololei ma luna o ka PCB surfaces, e hiki ai ke kiʻekiʻe kiʻekiʻe, miniaturized, māmā, hilinaʻi kiʻekiʻe, a me ka hana kiʻekiʻe.
□ ʻO nā huahana uila 3C (e like me nā smartphones, papa, laptops, smartwatches, headphones, routers, etc.) koi i ka miniaturization kiʻekiʻe, nā kiʻi slim, ka hana kiʻekiʻe,a wikiwiki
iteration.SMT nā laina e lawelawe ma ke ʻano he kikowaena hana kikowaena e hoʻoponopono pololei i kēia mau koi.
□ Loaʻa i ka Miniaturization Extreme a me ka māmā māmā:
Hiki iā SMT ke hoʻonohonoho paʻa i nā ʻāpana liʻiliʻi (e laʻa, 0201, 01005, a i ʻole nā mea pale / capacitors liʻiliʻi; nā pahu BGA/CSP maikaʻi) ma nā PCB, e hōʻemi nui ana i ka papa kaapuni.
kapuaʻi wāwae, ka nui o ka mea hana, a me ke kaumaha—he mea hoʻoikaika koʻikoʻi no nā polokalamu kelepona e like me nā smartphones.
□ E ho'ā ana i ka pilina kiʻekiʻe a me ka hana kiʻekiʻe:
Ke koi nei nā huahana 3C o kēia wā i nā hana paʻakikī, e koi ana i nā PCB kiʻekiʻe kiʻekiʻe interconnect (HDI) a me nā alahele koʻikoʻi multilayer. Hoʻokumu nā mana hoʻokomo pololei o SMT i ka
kumu no nā pilina hilinaʻi o nā wili kiʻekiʻe kiʻekiʻe a me nā ʻāpana kiʻekiʻe (e laʻa, nā kaʻina hana, nā modula hoʻomanaʻo, nā ʻāpana RF), e hōʻoia ana i ka hana maikaʻi loa o ka huahana.
□ Hoʻonui i ka maikaʻi o ka hana ʻana a me ka hōʻemi ʻana i nā kumukūʻai:
Hāʻawi nā laina SMT i ka automation kiʻekiʻe (paʻi, hoʻokomo, reflow, nānā), ultra-wikiwiki loa (e laʻa, ʻoi aku ka nui o ka waiho ʻana ma mua o 100,000 CPH), a me ka liʻiliʻi o ka hana lima. ʻO kēia
e hōʻoia i ka kūlike kūʻokoʻa, ka nui o nā hua kiʻekiʻe, a me ka hoʻohaʻahaʻa nui ʻana i nā kumukūʻai no kēlā me kēia ʻāpana i ka hana nui-e kūlike me nā koi huahana 3C no ka manawa wikiwiki a me ka mākeke.
kumu kūʻai hoʻokūkū.
□ E hōʻoia i ka hilinaʻi a me ka maikaʻi o ka huahana:
ʻO nā kaʻina hana SMT kiʻekiʻe-me ka paʻi pololei ʻana, kahi hoʻonohonoho kiʻekiʻe-pololei, ka hoʻoponopono ʻana i ka reflow profiling, a me ka nānā ʻana i loko o ka laina-e hōʻoiaʻiʻo i ke kūpaʻa a me ka
hilinaʻi. ʻO kēia ka mea e hōʻemi nui ai i nā hemahema e like me nā hui anu, ka hoʻopili ʻana, a me ka misalignment o nā ʻāpana, e hālāwai me nā koi koʻikoʻi o nā huahana 3C.
kaiapuni (eg, vibration, thermal cycling).
□ Ke hoʻololi ʻana i ka hoʻololi ʻana i ka huahana wikiwiki:
ʻO ka hoʻohui ʻana o nā loina Flexible Manufacturing System (FMS) e hiki ai i nā laina SMT ke hoʻololi wikiwiki i waena o nā kumu hoʻohālike huahana, e pane ikaika ana i ka ulu wikiwiki.
koi o ka mākeke 3C.
Hoʻopili ʻia ʻo Laser
Hiki ke ho'ā i ka hoʻoheheʻe ʻana i ka wela e pale aku i ka pōʻino i nā ʻāpana thermosensitive. Hoʻohana i ka hana hoʻopili ʻole e hoʻopau i ke koʻikoʻi mechanical, pale i ka hoʻoneʻe ʻana o ka ʻāpana a i ʻole ka hoʻololi ʻana o ka PCB — i hoʻopaʻa ʻia no nā ʻaoʻao curved/regular.
Kuʻi ʻana i ka nalu koho
Hoʻokomo ʻia nā PCB lehulehu i ka umu reflow, kahi e hoʻoheheʻe ʻia ai ka paʻi solder i kahi kiʻi wela (preheating, soking, reflow, cooling). ʻO kēia ka mea e hiki ai i ka pulu ʻana o nā pads a me nā mea alakaʻi, e hana i nā mea paʻa metallurgical hilinaʻi (nā hui kūʻai), a ukali ʻia e ka paʻa ʻana i ka hoʻoilo. ʻO ka hoʻokele ʻana i ka wela ka mea nui no ka maikaʻi weld a me ka hilinaʻi lōʻihi.
ʻO ka hoʻokuʻu ʻana i ka laina holoʻokoʻa holoʻokoʻa piha
Hoʻokomo ʻia nā PCB lehulehu i ka umu reflow, kahi e hoʻoheheʻe ʻia ai ka paʻi solder i kahi kiʻi wela (preheating, soking, reflow, cooling). ʻO kēia ka mea e hiki ai i ka pulu ʻana o nā pads a me nā mea alakaʻi, e hana i nā mea paʻa metallurgical hilinaʻi (nā hui kūʻai), a ukali ʻia e ka paʻa ʻana i ka hoʻoilo. ʻO ka hoʻokele ʻana i ka wela ka mea nui no ka maikaʻi weld a me ka hilinaʻi lōʻihi.
Mīkini AOI
Nānā AOI ma hope o ke kahe hou ʻana:
Ma hope o ka hoʻoheheʻe hou ʻana, hoʻohana nā ʻōnaehana AOI (Automated Optical Inspection) i nā pahupaʻikiʻi kiʻekiʻe a me nā polokalamu hoʻoponopono kiʻi e nānā ʻokoʻa i ka maikaʻi o ka hui pū ʻana ma nā PCB.
Hoʻopili kēia i ka ʻike ʻana i nā hemahema e like me:Nā Kuʻuna Kuʻuna: ʻAʻole lawa/nui ka solder, nā hui anu, ka hoʻopili.Nā hemahema o ka ʻāpana: Misalignment, nalo nā ʻāpana, nā ʻāpana hewa, polarity hoʻohuli ʻia, ka pōhaku kupapaʻu.
Ma ke ʻano he node mana koʻikoʻi koʻikoʻi ma nā laina SMT, hōʻoia ʻo AOI i ka hana pono.
Mīkini wiliwili i alakaʻi ʻia e ka hihiʻo
I loko o nā laina SMT (Surface Mount Technology), ke hana nei kēia ʻōnaehana ma ke ʻano he mea hana ma hope o ka hui ʻana, e hoʻopaʻa ana i nā ʻāpana nui a i ʻole nā mea hoʻolālā i nā PCB-e like me ka wela wela, nā mea hoʻohui, nā pale hale, a me nā mea ʻē aʻe.
