E hāʻawi mākou i nā palapala huahana a me nā hua'ōlelo no kāu noi.
Hoʻohana i ka ʻoihana ʻenehana hou
ʻO GREEN kahi National High-Tech Enterprise i hoʻolaʻa ʻia no ka R&D a me ka hana ʻana o ka hui uila uila a me nā lako semiconductor packaging & hoʻāʻo. Ke lawelawe nei i nā alakaʻi ʻoihana e like me BYD, Foxconn, TDK, SMIC, Canadian Solar, Midea, a me 20+ mau ʻoihana Fortune Global 500. ʻO kāu hoa hilinaʻi no nā hāʻina hana kiʻekiʻe.
I loko o ka ʻoihana ikehu hou, ʻelima mau ʻenehana kumu - ʻo ka hāʻawi ʻana i ka adhesive dispensing, soldering, screw fastening, automated optical inspection (AOI), and wire bonding - hoʻokumu i ka iwi kuamoʻo o ka maikaʻi o ka hana ʻana ma waena o nā ʻeke pākahi, nā panela lā, a me nā ʻāpana kaʻa uila. Hiki pololei kēia mau kaʻina hana i nā hopena koʻikoʻi: Palekana ma o ka hoʻopaʻa ʻana i ka pākaukau leak-proof a me nā pilina mana kiʻekiʻe hilinaʻi; ʻO ka maikaʻi ma o ka pololei automated e hōʻemi i ka ʻōpala hana; a me ka Paʻa ma o nā paʻa paʻa a me nā mea hoʻopaʻa hiki ke kū i nā kaiapuni koʻikoʻi e like me nā haʻalulu EV a me ka ʻike ʻana o ka lā i waho.
Hoʻohui pū ʻia kēia mau ʻenehana i ka scalability a me ka hilinaʻi o nā hoʻonā ikehu maʻemaʻe - mai nā gigafactories e hana ana i nā pākahi o nā hanauna e hiki mai ana i ka ʻenehana grid akamai - e kākoʻo ana i ka hoʻonui wikiwiki ʻana o ka honua aʻo ka hōʻoia ʻana i ka hoʻokō ʻana o nā huahana hopena a me nā kūlana palekana.
He aha kāu ʻoihana?
Hana Hana Kaa Uila Hou
Nā Module IGBT: E hoʻohana i ka hoʻokaʻawale ʻana i nā ʻāpana ʻelua no ka hoʻoponopono ʻana i ka ratio hui ʻana, e hōʻoiaʻiʻo ana i ka insulation a me ka hana wela.
Pākuʻi Paʻa: E hoʻohana i ka ʻenehana potting vacuum no ka sila ʻana, e hālāwai me nā kūlana pale ʻoihana ʻoihana no ka pale ʻana i ka wai a me ka haʻalulu.
Hana Kiʻi kiʻi kiʻi
Pono nā ʻāpana ʻelua ʻaoʻao a me ka heterojunction (HJT) i ka mana o ka laulā glue a me ka hoʻohālikelike ʻana me nā mea kūʻai kiʻekiʻe-weather (e laʻa, silicone/epoxy resin) e hōʻoia i ka pono o ka sila lōʻihi. Loaʻa nā ʻōnaehana dispensing i alakaʻi ʻia e ka ʻike inline i ka hoʻopiha pololei ʻana no nā module curved a me nā micro-gaps.
Lako Hoahu Ehue
Hiki i ka thermal conductive adhesives ke hoʻopiha piha i nā hale waihona waihona ikehu, e hoʻololi ana i nā kūlana kaʻa kaʻa wela ʻoiai e hoʻonui nui ana i ka hilinaʻi o ka ʻōnaehana.
Na Mekini Hoolaha
Hoʻonohonoho ʻia ʻo CCD Vision
ʻO ke ala neʻe polokalamu: Point, Line, Arc, Curve, Polyline, Spiral, Ellipse etc.
Kino Valve: Pneumatic / Piezo Jet Valve, Suction / Needle Valve, Single / Dual-Component Screw Valve, 30 / 55CC Syringe, etc.
Inline 6-Axis Robotic Dispensing System
Māhele Hoʻolaha: 500 * 400mm
Hiki ke hana hou: ± 0.02 mm
Mīkini Kūʻai Kūʻai Kū i ka papahele
Hoʻokaʻawale ʻana:X 800,Y1 500,Y2 500,Z 100mm
Hiki ke hana hou: ± 0.02 mm
'Otomactic High-Speed In-Line Dispensing Machine
MAX Hoʻolaha Hoʻolaha (Hoʻokahi/Palua Track): 350*500mm/350*200mm（W*D）
XYZ Hiki hou:XY: ±10um@3σ;Z:±5um@3σ
Kaa Uila Uila Hou
IGBT Precision Soldering: Hoʻemi nui ka ʻenehana hoʻoheheʻe laser i ka hoʻokomo wela, e pale ana i ka pōʻino i nā modula mana i ka wā e loaʻa ai nā pilina kikoʻī kiʻekiʻe.
Wehe Metala ʻokoʻa: E lanakila ana i nā pilikia hoʻohālikelike i nā hui keleawe-aluminika, e hiki ai i nā kiko solder lahilahi (<0.3mm) no nā pilina uila māmā.
Pūnaehana Photovoltaic
Miniature Power Electronics: Hoʻopili i nā koi kūʻai micro-pitch ma nā PCB kiʻekiʻe kiʻekiʻe, e hoʻololi ana i nā kaʻina hana maʻamau me nā hopena laina hana automated.
Lako Hoahu Ehue
ʻO ka hana ʻana i nā hāmeʻa mālama ʻana i ka ikehu: E hoʻoponopono i nā hoʻokūkū pili hilinaʻi kiʻekiʻe ma waena o nā modula pākaukau a me nā ʻāpana mana, e hōʻoia ana i ka paʻa o ka hana lōʻihi.
Nā Mīkini Kūʻai Laser
Hoʻonohonoho ʻia ʻo CCD Vision
ʻO ke ala neʻe polokalamu: Point, Line, Arc, Curve, Polyline, Spiral, Ellipse etc.
Kino Valve: Pneumatic / Piezo Jet Valve, Suction / Needle Valve, Single / Dual-Component Screw Valve, 30 / 55CC Syringe, etc.
Mīkini Kuʻekuʻe Blue Laser Kuʻuna Papa
X, Y, Z Axis Hele: X 400,Y 400, Z 130(mm)
Fiber Core Anawaena: 400um
E hana hou i ka pololei o ke kau ʻana: ±0.02mm
Laser Solder Paste Solder Machine
Pūnaehana Kūlana: ±0.01mm
Hoʻolālā ʻia no ke kūʻai aku ʻana i ka FPC/PCB, me nā mea pili i ka wela a me nā SMD me ke kūpaʻa wela haʻahaʻa
Mīkini Kuʻi Poʻo ʻekolu
X/Y/Z Kaahele: X150*Y200*Z100mm
Hiki ke hana hou: ± 0.02 mm
Anawaena Uea Kuʻi: φ0.5~φ2mm
E hāʻawi mākou i nā palapala huahana a me nā hua'ōlelo no kāu noi.
