Hoʻohana i ka ʻoihana Semiconductor
ʻO GREEN kahi National High-Tech Enterprise i hoʻolaʻa ʻia no ka R&D a me ka hana ʻana o ka hui uila uila a me nā lako semiconductor packaging & hoʻāʻo. Ke lawelawe nei i nā alakaʻi ʻoihana e like me BYD, Foxconn, TDK, SMIC, Canadian Solar, Midea, a me 20+ mau ʻoihana Fortune Global 500. ʻO kāu hoa hilinaʻi no nā hāʻina hana kiʻekiʻe.
Hiki i nā mīkini hoʻopaʻa ke hoʻopili i nā micro-interconnects me nā anawaena uwea, e hōʻoia ana i ka pololei o ka hōʻailona; ʻO ka formic acid vacuum soldering e hana i nā hui hilinaʻi ma lalo o ka ʻike o ka oxygen <10ppm, e pale ana i ka hāʻule ʻana o ka oxidation i loko o ka pahu kiʻekiʻe; Hoʻopili ʻo AOI i nā hemahema pae micron. Hōʻoia kēia synergy> 99.95% ka hoʻonui ʻia ʻana o ka hoʻopihapiha hoʻopihapiha, e hālāwai ana i nā koi hoʻāʻo koʻikoʻi o 5G/AI chips.
Hoʻopili Uea Ultrasonic
Hiki ke hoʻopaʻa i 100 μm–500 μm uea alumini, 200 μm–500 μm uea keleawe, nā lipine alumini a hiki i 2000 μm ākea a me 300 μm mānoanoa, a me nā lipine keleawe.
Laulā huakaʻi: 300 mm × 300 mm, 300 mm × 800 mm (hiki ke hoʻololi ʻia), me ka hiki ke hana hou ʻia <±3 μm
Kaʻahele huakaʻi: 100 mm × 100 mm, me ka hana hou <±3 μm
He aha ka ʻenehana Wire Bonding?
ʻO ka hoʻopaʻa ʻana i ka uea kahi ʻenehana interconnection microelectronic i hoʻohana ʻia e hoʻopili i nā mea semiconductor i kā lākou ʻeke a i ʻole substrates. ʻOiai ʻo ia kekahi o nā ʻenehana koʻikoʻi loa i ka ʻoihana semiconductor, hiki iā ia ke hoʻopili i ka chip me nā kaapuni waho i nā mea uila.
Na Mea Uea Hoopaa
1. Aluminum (Al)
ʻOi aku ka maikaʻi o ka uila me ke gula, ʻoi aku ka maikaʻi
2. Ke keleawe (Cu)
25% kiʻekiʻe o ka uila/thermal conductivity ma mua o Au
3. Gula (Au)
ʻO ka conductivity maikaʻi loa, ka pale ʻana i ka corrosion, a me ka hilinaʻi paʻa
4. Kālā (Ag)
ʻO ka conductivity kiʻekiʻe ma waena o nā metala
Uea Aluminum
Lipine Aluminum
Uea keleawe
Lipine keleawe
Semiconductor Die Bonding & Wire Bonding AOI
Hoʻohana i ka pahupaʻikiʻi ʻoihana 25-megapixel e ʻike ai i nā hemahema o ka hoʻopili ʻana a me ka hoʻopaʻa ʻana i nā uea ma nā huahana e like me ICs, IGBTs, MOSFETs, a me nā papa alakaʻi, e loaʻa ana ka helu ʻike defect ma mua o 99.9%.
Na hihia nana
Hiki ke nānā i ke kiʻekiʻe a me ka palahalaha, offset chip, tilt, a me ka ʻoki ʻana; pōpō solder non-adhesion a me solder joint detachment; nā hemahema hoʻopaʻa uea e like me ke kiʻekiʻe a i ʻole lawa ʻole o ka loop, hāʻule ka loop, nā uea haki, nā uea nalowale, ka hoʻopili uea, ke kuʻi uea, ke ala ʻana, a me ka lōʻihi o ka huelo; lawa ʻole ka hoʻopili; a me ka paʻipaʻi metala.
Poepoe Solder/ Koena
ʻAkaʻi Chip
Hoʻokomo Chip, Ana, Tilt Meas
Hoʻohaumia Chip/Mako Haole
ʻOki ʻōpuʻu
Nā ʻauwaha Seramika
Hoʻohaumia ʻana i ka ʻauwaha Ceramic
ʻO ka AMB Oxidation
I-Line Formic Acid Reflow Oven
1. ʻO ka wela kiʻekiʻe ≥ 450 ° C ， ka palena haʻahaʻa haʻahaʻa <5 Pa
2. Kākoʻo i nā kaiapuni formic acid a me nā kaʻina hana nitrogen
3. Hoʻokahi helu helu ʻole ≦ 1%, holoʻokoʻa holoʻokoʻa ≦ 2%
4. Hoʻoluʻu wai + hoʻoluʻu nitrogen, hoʻolako ʻia me kahi ʻōnaehana hoʻoheheʻe wai a me ka hoʻoheheʻe ʻana
IGBT Power Semiconductor
ʻO ka nui o ka hoʻokuʻu ʻana i ka IGBT soldering hiki ke hoʻoulu i ka hāʻule ʻana o ke kaulahao e like me ka holo ʻana o ka wela, ka haki ʻana i ka mīkini, a me ka hōʻino ʻana i ka hana uila. ʻO ka hōʻemi ʻana i ka helu ʻole i ≤1% e hoʻonui nui i ka hilinaʻi o ka hāmeʻa a me ka pono o ka ikehu.
IGBT Kaʻina hana holoʻokoʻa
