Nā Lako Hoʻopaʻa IC Semiconductor/Mīkini Hoʻopaʻa Aluminum Wedge GR-W01

Semiconductor IC Bonding Equipment/Aluminum Wedge Bonding Machine GR-W01 Kiʻi Hōʻikeʻike

No nā pihi mana ikehu hou, photovoltaic inverters, automotive electronics, energy storage, IGBT, BMS battery safety control boards, etc;

Hiki i kēia mīkini hoʻopaʻa uea ke kūpono me ka alumini a me ke kaula keleawe;

E hoʻouna i ka leka uila iā mākou

Huahana Huahana

Hiʻona Huahana

●Hoʻohui i nā uwea mānoanoa a me nā ʻāpana i loko o ka anuu mīkini me ka hoʻololi wikiwiki ʻana o ka ʻōnaehana;
●Ma o ke kaʻina hana hoʻoheheʻe patented, hiki ke hoʻololi ʻia nā ʻāpana kuʻihao i ka manawa maoli no ka ʻili o nā mea hoʻololi e hōʻoia i ka maikaʻi kuʻi hou ʻana;
●E hoʻokō i ka ʻike ma o ka hoʻohui ʻole ʻana e pili ana i nā lula ʻOihana 4.0/OT;
●Achieve the best material matching through a variety of ultrasonic frequencies e koho mai, a paipai i ka paʻa o ke kaʻina hana;
●Integration o kaʻenehana kaʻina a me ka automation mai hoʻokahi kumu o ka lako.